Global Semiconductor Wafer Polishing and Grinding Equipment Market

Global Semiconductor Wafer Polishing and Grinding Equipment market size was valued US$ XX Mn in 2019 and the total revenue is expected to grow at 4.49% through 2020 to 2027, reaching US$ XX Mn.

Global Semiconductor Wafer Polishing and Grinding Equipment market

Global Semiconductor Wafer Polishing and Grinding Equipment market

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Global Semiconductor Wafer Polishing and Grinding Equipment market Overview:

The growing demand in MEMS, IC manufacturing, optics, & compound semiconductors will increase the planarization in semiconductor devices. In the present market situation, as almost all the electronic devices, with laptops, smartphones, computers, etc., make use of Silicon ICs & other wafer dependent packages, the demand for progressive grinding & polishing machinery is always on the growth.

In fact, according to MMR study silicon wafer shipments for semiconductor applications is projected to reach 17,600 Mn Square Inches by 2027, from 11,810 MSI in the year 2019. This market situation is estimated to open some opportunities for the polishing & grinding equipment market during the forecast period. The yearly data published by SEMI shown that there had been a minor dip in the silicon wafer shipments for the year 2019 (11,810 MSI) following a nonstop growth until 2018 (12,732 MSI) as a result of overall economic slowdown & ongoing geopolitical tensions that have negatively impacted silicon demand for the year.

Further, the rising need for decrease in the electronics is expected to drive some developments in the Semiconductor Wafer Polishing and Grinding Equipment market market during the forecast period. However, the recent developments in etching, which bid more advantages when compared to the polishing methods, are affecting the demand for polishing machinery. Moreover, the elimination of partial defects through polishing with traditional CMP technology preserves the surface profile, making it very difficult for manufacturers & service providers involved in wafer reclaim activities.

Also, the current Covid-19 is anticipated to have a major effect on the silicon wafer market sales through the globe. A recent quarterly report from SEMI laid out two market states for the semiconductor wafer market in the 2nd half of 2020. First, the sales could see further dip amidst the uncertainty surrounding the impact of corona virus to the semiconductor industry. Second, the semiconductor industry could hike on the strength of recovering chip sales.

Global Semiconductor Wafer Polishing and Grinding Equipment market1

According to MMR study, the dip in silicon wafer sales in the 2nd half of 2020 could have ripple effects on price negotiations in the year 2021. Wafer shipments, supply & demand shifts, suppliers’ dynamics, & pricing trends are considered for the same. Due to such a situation, the sale of 300mm silicon wafer shipments might see a minor decline, whereas the 200mm & 150mm shipments would drop by 5 percent & 13 percent, respectively, in the 1st half of 2020.
Rising Consumption of Consumer Electronics is Anticipated to Positively Impact the Market:

The technical advancements in consumer electronic devices, like smartphones & tablets, and the growth of smart home devices & wearables globally are driving the need for small integrated circuits. This, in turn, is powering the demand for wafer polishing & grinding equipment, which plays an essential role in the semiconductor wafer fabrication process. The global demand for the semiconductor materials market is being driven by smartphones & other applications through consumer electronics, automotive applications, etc. These industries have been encouraged by technology transitions like wireless technologies (5G), Artificial intelligence, etc. Also, the trend of growing numbers of Internet of Things (IoT) devices is estimated to force the semiconductor industry to invest in this equipment, in a bid to attain intelligent products.

Furthermore, in the year 2019, Apple declared a contribution of USD 350 Bn to the US economy by the year 2023 & promised 2.4 Mn jobs, during the forecast period, which includes of the latest investments & its existing spending with local companies for supply & manufacturing. The company is one of the key players in the consumer electronics industry; hence, the announcement is projected to propel the demand for semiconductors. Every smartphone is included of a System on a Chip (SoC), which is an IC that integrates all or most components of a computer or other electronic system. SoC chips are usually fabricated using metal oxide semiconductor (MOS) technology & are sent to a wafer fabrication plant to create the SoC dice before packaging & testing where wafer polishing & grinding is done. According to MMR study, the global smartphone users are of 3.2 Bn in the year 2019 & are anticipated to grow to 3.8 Bn by 2021, which in turn is anticipated to impact the market positively.

The report covers Semiconductor Wafer Grinding Equipment, Semiconductor Wafer Polishing Equipment with detailed analysis Global Semiconductor Wafer Polishing and Grinding Equipment market industry with the classifications of the market on the Type, Application & region. Analysis of past market dynamics from 2016 to 2019 is given in the report, which will help readers to benchmark the past trends with current market scenarios with the key players’ contribution in it. The report has profiled twelve key players in the market from different regions. However, the report has considered all market leaders, followers, and new entrants with investors while analyzing the market and estimation the size of the same. The manufacturing environment in each region is different and focus is given on the regional impact on the cost of manufacturing, supply chain, availability of raw materials, labor cost, availability of advanced Plastic Type, trusted vendors are analyzed and the report has come up with recommendations for a future hot spot in five regions. The major country’s policies about manufacturing & Covid 19 impact on demand side are covered in the report.
Scope of the Global Semiconductor Wafer Polishing and Grinding Equipment market: Inquire before buying

Global Semiconductor Wafer Polishing and Grinding Equipment market2
Global Semiconductor Wafer Polishing and Grinding Equipment market, by Region

• North America:
o US
o Canada
• Europe
o UK
o Germany
o France
o Spain
o Italy
o Sweden
o CIS countries
o Rest of Europe
• APAC
o China
o India
o South Korea
o Japan
o Australia
o Rest of APAC
o ASEAN
 Indonesia
 Malaysia
 Singapore
 Thailand
 Vietnam
• Middle East & Africa
o GCC Countries
o South Africa
o Rest of MEA
• Latin America
o Mexico
o Brazil
o Rest of Latin America
Global Semiconductor Wafer Polishing and Grinding Equipment market Key Players

• TOKYO SEIMITSU
• Revasum
• Logomatic
• Logitech
• Lapmaster
• Entrepix
• EBARA
• Applied Materials
• Axus Technology
• Tesla
• ASM International
• Hitachi High-Technologies Co.
• Lam Research Co.
• KLA-Tencor Co.
• Screen Semiconductor Solutions.
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This Report Is Submitted By : Maximize Market Research Company
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Maximize Market Research provides B2B and B2C research on 20,000 high growth emerging opportunities & technologies as well as threats to the companies across the Healthcare, Pharmaceuticals, Electronics & Communications, Internet of Things, Food and Beverages, Aerospace and Defense and other manufacturing sectors.

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